Nuclear Clean Energy ↔ relates to ↔ Semiconductor

the current knowledge of nuclear reactor behavior was discovered at what is now Idaho National Laboratory. John Grossenbacher, a former INL director, said, "The history of nuclear energy for peaceful application has principally been written in Idaho". The present facility resulted from the 2005 merger of two neighboring laboratories, the National Engineering and Environmental Laboratory, and the Idaho site of the western branch of Argonne National Laboratory (Argonne-West). Various organizations have built more than 50 reactors at what is commonly called "the Site", including the ones that gave the world its first usable amount of electricity from nuclear power and the power plant for the world's first nuclear submarine. Although many are now decommissioned, these facilities are the largest concentration of reactors in the world. It is on a 890-square-mile (2,310 km2) complex in the high desert of eastern Idaho, between Arco to the west and Idaho Falls and Blackfoot to the east. Atomic City, Idaho is just south.

Light Water Reactor Sustainability (LWRS) program The Light Water Reactor Sustainability Program supports national efforts to do the research and gather the information necessary to demonstrate whether it is safe and prudent to apply for extensions beyond 60 years of operating life. The Program aims to safely and economically extend the service lives of the more than 100 electricity-generating nuclear power plants in the United States. The program brings together technical information, performs important research and organizes data to be used in license-extension applications. Advanced Test Reactor National Scientific User Facility (ATR NSUF) INL's Advanced Test Reactor is a research reactor located approximately 50 miles (80 km) from Idaho Falls, Idaho. The Department of Energy named Advanced Test Reactor (ATR) a National Scientific User Facility in April 2007. This designation opened the facility to use by university-led scientific research groups and gives them free access to the ATR and other resources at INL and partner facilities.

Nuclear Energy University Programs (NEUP) DOE's Nuclear Energy University Programs provide funding for university research grants, fellowships, scholarships and infrastructure upgrades. For example, in May 2010, the program awarded $38 million for 42 university-led R&D projects at 23 United States universities in 17 states. In FY 2009, the program awarded about $44 million to 71 R&D projects and more than $6 million in infrastructure grants to 30 U.S. universities and colleges in 23 states. INL's Center for Advanced Energy Studies administers the program for DOE. CAES is a collaboration between INL and Idaho's three public research universities: Idaho State University, Boise State University and University of Idaho. Multiphysics Methods Group (MMG) The Multiphysics Methods Group (MMG) is a program at Idaho National Laboratory (under the United States Department of Energy) begun in 2004. It uses applications based on the multiphysics and modeling framework MOOSE to simulate complex physical and chemical reactions inside nuclear reactors . The ultimate goal of the program is to use these simulation tools to enable more efficient use of nuclear fuel, resulting in lower electricity costs and less waste products. The MMG focuses on problems within nuclear reactors related to its fuel and how heat is transferred inside the reactor. "Fuel degradation" refers to how uranium pellets and the rods they are encased in (several rods bundled together is what makes a "fuel assembly") eventually wear out over time due to high heat and irradiation inside a reactor. The group states three main objectives: "The mission of the MMG is to support the INL goal to advance the U.S.

Micron Technology, Inc. is an American multinational semiconductor company that manufactures computer memory and computer data storage products, including dynamic random-access memory (DRAM), flash memory, High Bandwidth Memory (HBM), and solid-state drives (SSDs). Founded in 1978 in Boise, Idaho, Micron is the only major American computer memory manufacturer. It is one of the "Big Three" computer memory manufacturers, along with the South Korean companies Samsung Electronics and SK Hynix. Micron marketed its consumer products under the brand Crucial, with the sub-brand Ballistix being used to denote products targeting gaming computers, until its disestablishment on 2026. Micron and Intel together created IM Flash Technologies, which produced NAND flash memory. It owned Lexar between 2006 and 2017. Sanjay Mehrotra has served as president and CEO of Micron since 2017. On May 26, 2026, Micron became the latest U.S.

Since 2000 In 2000, Gurtej Singh Sandhu and Trung T. Doan at Micron initiated the development of atomic layer deposition high-k films for DRAM memory devices. This helped drive cost-effective implementation of semiconductor memory, starting with 90 nm node DRAM. Pitch double-patterning was also pioneered by Gurtej Singh Sandhu at Micron during the 2000s, leading to the development of 30-nm class NAND flash memory, and it has since been widely adopted by NAND flash and RAM manufacturers worldwide. In 2002, Micron spun off its personal computer business as MPC Corporation and put it up for sale. The company found the business difficult as the number 12 American computer maker with only 1.3 percent of the market. Micron and Intel created a joint venture in 2005, based in IM Flash Technologies in Lehi, Utah. The two companies formed another joint venture in 2011, IM Flash Singapore, in Singapore. In 2012 Micron became sole owner of this second joint venture. In 2006 Micron acquired Lexar, an American manufacturer of digital media products. The company changed leadership again in June 2007 with COO Mark Durcan becoming president. In 2008, Micron converted the Avezzano chip fab, formerly a Texas Instruments DRAM fab, into a production facility for CMOS image sensors sold by Aptina Imaging. In 2008, Micron spun off Aptina Imaging, which was acquired by ON Semiconductor in 2014. Micron retained a stake in the spinoff. However, the core company suffered setbacks and had to lay off 15 percent of its workforce in October 2008, during which period the company also announced the purchase of Qimonda's 35.6 percent stake in Inotera Memories for $400 million. The trend of layoffs and acquisitions continued in 2009 with the termination of an additional 2,000 employees, and the acquisition of the FLCOS microdisplay company Displaytech. Micron agreed to buy flash-chip maker Numonyx for $1.27 billion in stock in February 2010. On February 3, 2012, CEO Appleton died in a plane crash shortly after takeoff from the Boise Airport. He was the pilot and sole occupant of the Lancair IV aircraft. Mark Durcan replaced Appleton as the CEO shortly thereafter, eliminating his former title of president. In 2013, the Avezzano chip fab was sold to LFoundry. In the 2012 to 2014 period, Micron again went through an acquisition-layoff cycle, becoming the majority shareholder of Inotera Memories, purchasing Elpida Memory for $2 billion and the remaining shares in Rexchip, a PC memory chip manufacturing venture between Powerchip and Elpida Memory for $334 million, while announcing plans to lay off approximately 3,000 workers. Through the Elpida acquisition, Micron became a major supplier to Apple Inc. for the iPhone and iPad. In December 2016 Micron finished acquiring the remaining 67 percent of Inotera, making it a 100 percent subsidiary of Micron. In April 2017, Micron announced Sanjay Mehrotra as the new president and CEO to replace Mark Durcan. In June 2017 Micron announced it was discontinuing the Lexar retail removable media storage business and putting some or all of it up for sale. In August of that year the Lexar brand was acquired by Longsys, a flash memory company based in Shenzhen, China. In May 2018, Micron Technology and Intel launched QLC NAND memory to increase storage density. The company ranked 150th on the Fortune 500 list of largest United States corporations by revenue. In February 2019, the first microSD card with a storage capacity of 1 terabyte (TB) was announced by Micron. As of March 2020 3.84TB Micron 5210 Ion is the cheapest large-capacity SSD in the world. In September 2020 the company introduced the world's fastest discrete graphics memory solution. Working with computing technology leader Nvidia, Micron debuted GDDR6X in the Nvidia GeForce RTX 3090 and GeForce RTX 3080 graphics processing units (GPUs). In November 2020, the company unveiled a new 176-layer 3D NAND module. It offers improved read and write latency and is slated to be used in the production of a new generation of solid-state drives. On October 22, 2021, Micron closed the sale of IM Flash's Lehi, Utah fab to Texas Instruments for a sale price of US$900 million. In February 2022, Micron announced that it would discontinue its Ballistix gaming brand. With the passage of the CHIPS and Science Act, Micron announced its pledge to invest billions in new manufacturing within the United States. In September 2022, Micron announced it would invest $15 billion in a new facility in Boise, Idaho. In October 2022, Micron announced a $100 billion expansion in Clay, New York. Micron Technology owed Netlist, Inc. $445 million in damages for infringing Netlist's patents related to memory-module technology for high-performance computing. The jury found that Micron's semiconductor-memory products violated two of Netlist's patents willfully, potentially allowing the judge to triple the damages. Netlist had sued Micron in 2022, accusing three of its memory-module lines of patent infringement, which Micron denied, also arguing the patents' invalidity. The U.S.

n since 2017. On May 26, 2026, Micron became the latest U.S. company to reach a US$1 trillion market capitalization, amid surging demand for its HBM chips. History 1978–1999 Micron was founded in Boise, Idaho, in 1978 by Ward Parkinson, Joe Parkinson, Dennis Wilson, and Doug Pitman as a semiconductor design consulting company. Startup funding was provided by local Idaho businessmen Tom Nicholson, Allen Noble, Rudolph Nelson, and Ron Yanke. Later it received funding from Idaho billionaire J. R. Simplot, whose fortune was made in the potato business. In 1981, the company moved from consulting to manufacturing with the completion of its first wafer fabrication unit ("Fab 1"), producing 64K DRAM chips. In 1984, the company had its initial public offering. Micron sought to enter the market for RISC processors in 1991 with a product known as FRISC, targeting embedded control and signal processing applications. Running at 80 MHz and described as "a 64-bit processor with fast context-switching time and high floating-point performance", the design supported various features for timely interrupt handling and featured an arithmetic unit capable of handling both integer and floating-point calculations with a claimed throughput of 80 MFLOPS for double-precision arithmetic. Micron aimed to provide a "board-level demonstration supercomputer" in configurations with 256 MB or 1 GB of RAM. Having set up a subsidiary and with the product being designed into graphics cards and accelerators, Micron concluded in 1992 that the effort would not deliver the "best bang for the buck", reassigning engineers to other projects and discontinuing the endeavour. In 1994, founder Joe Parkinson retired as CEO and Steve Appleton took over as Chairman, President, and CEO. A 1996 3-way merger among ZEOS International, Micron Computer, and Micron Custom Manufacturing Services (MCMS) increased the size and scope of the company; this was followed rapidly with the 1997 acquisition of NetFrame Systems, in a bid to enter the mid-range server industry.

nt, and dissemination of data and information, including training artificial intelligence, housing IT infrastructure, computer systems, and associated components. The Energy Independence and Security Act of 2007 defines a data center as "any facility that primarily contains electronic equipment used to process, store, and transmit digital information." This includes "a free-standing structure" or "a facility within a larger structure, that uses environmental control equipment to maintain the proper conditions for the operation of electronic equipment." According to IBM, data centers date back to the 1940s; the U.S. military's Electrical Numerical Integrator and Computer (ENIAC) was an early example. Depending on workloads, data centers have different models. An enterprise (on-premises) model hosts the IT infrastructure and data on-premises. Cloud data centers, which include hyperscale data centers, house IT infrastructure resources through an Internet connection, used by cloud service providers like Amazon Web Services, Google Cloud Platform, IBM Cloud, and Microsoft Azure; they usually contain 5,000 servers and miles of connection equipment, being as large as 60,000 square feet. Managed service data centers have third party managers hired on behalf of a company, leasing the equipment and infrastructure instead of buying it. Colocation data centers have companies rent space within a data center owned by others and located off company premises, as the colocation data center hosts the infrastructure, while the company provides and manages the components. Edge data centers are smaller, decentralized facilities located closer to end users and devices. In the 2024 U.S. Data Center Energy Usage Report, Lawrence Berkeley National Laboratory estimated that hyperscale and colocation centers contained 74% of the computer servers in 2023. Large data centers require significant energy to power their operations, leading to concerns about the large use of energy. The International Energy Agency (IEA) estimated that electricity consumption from these data centers amounts to around 415 terawatt hours (TWh), about 1.5% of global electricity consumption in 2024, at a growth rate of 12% per year over the last five years. The IEA projects this amount could double to reach around 945 TWh by 2030, growing by around 15% per year. In the U.S. alone, power consumption by data centers will be "almost half of the growth in electricity demand between now and 2030." According to Terry Nguyen and Ben Green of the Michigan Environmental Justice Coalition, a single data center can "consume up to 2 megawatt hours (MWh)," the same as "the equivalent power consumption of a small town." This includes increased electricity costs. According to a study in the academic journal Npj Clean Water, it was estimated that data centers consumed about 1.7 billion liters of water per day in 2021, with 57% drawn from potable supplies, noting that fewer than one-third of operators measured their water use. Concerns over environmental impacts, energy and water use, and other costs have led to opposition to new data centers during the AI boom. These movements have been seen in parts of Europe, the U.S., and South America.

onsumed about 1.7 billion liters of water per day in 2021, with 57% drawn from potable supplies, noting that fewer than one-third of operators measured their water use. Concerns over environmental impacts, energy and water use, and other costs have led to opposition to new data centers during the AI boom. These movements have been seen in parts of Europe, the U.S., and South America.

Data centers have their roots in the huge computer rooms of the 1940s, typified by the Electronic Numerical Integrator and Computer (ENIAC), one of the earliest examples of a data center. Early computer systems were complex to operate and maintain, and required a special environment in which to operate. Many cables were necessary to connect all of the components, and methods to accommodate and organize these were devised such as standard racks to mount equipment, raised floors, and cable trays (installed overhead or under the elevated floor). A single mainframe required a great deal of power and had to be cooled to avoid overheating. Security became important— computers were expensive, and were often used for government and military purposes. As such, basic design guidelines for controlling access to the computer room were devised. During the microcomputer industry boom of the 1980s, computers started to be deployed everywhere, in many cases with little or no care about operating requirements. However, as information technology (IT) operations started to grow in complexity, organizations grew aware of the need to control IT resources. The availability of inexpensive networking equipment, coupled with new standards for the network structured cabling, made it possible to use a hierarchical design that put servers in a specific room inside the company. The use of the term data center, as applied to specially designed computer rooms, started to gain popular recognition about this time. During the dot-com bubble (1997–2000), there was a boom in data center construction because companies needed fast Internet connectivity and non-stop operation to establish their Internet presence. Many companies started building very large facilities, called internet data centers (IDCs), which provided enhanced capabilities, such as crossover backup: "If a Bell Atlantic line is cut, we can transfer them to ... to minimize the time of outage." The global data center market saw steady growth in the 2010s, with a notable acceleration in the latter half of the decade. According to Gartner, worldwide data center infrastructure spending reached $200 billion in 2021, representing a 6% increase from 2020 despite economic challenges posed by the COVID-19 pandemic. In 2024, global energy consumption from data centers was 620 TWh, with 80% of that consumption concentrated in the U.S., China, and the United Kingdom. Colocation centers were the most common category worldwide, with 4,799 colocation centers in 127 countries. In that year, the largest data center in the world was Citadel, owned by Switch, at the Tahoe Reno Industrial Center in Reno, Nevada, occupying 7.2 million square feet. Growth of the data center industry has prompted local resistance. A 2023 survey found social mobilizations against the industry in Europe, the U.S., and South America. These movements expressed concern about the centers' energy and water use, pollution, and impact on agriculture or the landscape. A 2026 poll by Politico suggested that resistance to growth of the industry would make candidates' stance on data centers a significant issue for voters in the U.S. In the United States The U.S. hosted 5,381 data centers in March 2024, the highest number of any country worldwide, accounting for 40% of the global market in 2023. As of 2023, about 80% of U.S. data center load was concentrated in 15 states, led by Virginia and Texas. As of 2025, roughly one third of America's data centers were in three states: Virginia (643), Texas (395), and California (319). The largest concentration of data centers in the world is in Northern Virginia, with over 250 facilities in the region. In 2025, Georgia was the fastest growing data center hub in the U.S., having enacted several state tax exemptions for the industry and hosting between 100 and 150 centers in the state. Local governments have responded to the growing industry in Georgia with a variety of local ordinances to guide permitting of these facilities. The consultancy firm McKinsey & Co., projected U.S. demand to double to 35 gigawatts (GW) by 2030, up from 17 GW in 2022. A study published by the Electric Power Research Institute (EPRI) in May 2024 estimated that data centers could consume between 4.6% and 9.1% of the country's electricity generation by 2030. In 2025, it was estimated that the U.S.

ern Oregon to Boise, and is the most populated area in Idaho. Historically, the valley had been known as the Lower Snake River Valley or the Boise River Valley. Pete Olesen, president of the valley's association of local Chambers of Commerce, coined the name "Treasure Valley" in 1959 to reflect the treasure chest of resources and opportunities that the region offered. The valley has a very diverse terrain, from sage flatlands, to mesas, agricultural areas, and urbanized areas.

The Treasure Valley is a valley in the western United States, primarily in southwestern Idaho, where the Payette, Boise, Weiser, Malheur, and Owyhee rivers drain into the Snake River. It includes all the lowland areas from Vale in rural eastern Oregon to Boise, and is the most populated area in Idaho. Historically, the valley had been known as the Lower Snake River Valley or the Boise River Valley. Pete Olesen, president of the valley's association of local Chambers of Commerce, coined the name "Treasure Valley" in 1959 to reflect the treasure chest of resources and opportunities that the region offered. The valley has a very diverse terrain, from sage flatlands, to mesas, agricultural areas, and urbanized areas.

eflect the treasure chest of resources and opportunities that the region offered. The valley has a very diverse terrain, from sage flatlands, to mesas, agricultural areas, and urbanized areas. As the Boise Metropolitan Area grows, more and more undeveloped and agricultural land is being urbanized. History Settling the region The tribes that roamed the area, specifically, were the Northern Paiute and Shoshone. In 1834, Thomas McKay built the original Fort Boise, in the area near present-day Parma, which was run for a time by Francois Payette. It later was moved because of flooding troubles and was abandoned in 1854. The Oregon Trail runs through the Treasure Valley. The valley was settled for the most part by ranchers and farmers, initially to supply the gold and silver mining communities in the higher elevations nearby: Idaho City in the Boise Basin and Silver City in the Owyhees. A new Fort Boise was constructed by the U.S. Army in 1863 in present-day Boise, from which the city grew.

and OLED displays. The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the central part being the "clean room". In more advanced semiconductor devices, such as modern 14/10/7 nm nodes, fabrication can take up to 15 weeks, with 11–13 weeks being the industry average. Production in advanced fabrication facilities is completely automated, with automated material handling systems taking care of the transport of wafers from machine to machine. A wafer often has several integrated circuits, which are called dies as they are pieces diced from a single wafer. Individual dies are separated from a finished wafer in a process called die singulation, also called wafer dicing. The dies can then undergo further assembly and packaging. Within fabrication plants, the wafers are transported inside special sealed plastic boxes called FOUPs. FOUPs in many fabs contain an internal nitrogen atmosphere which helps prevent copper from oxidizing on the wafers. Copper is used in modern semiconductors for wiring. The interior components of the processing equipment and FOUPs is kept cleaner than the surrounding air in the cleanroom. This internal atmosphere is known as a mini-environment and helps improve yield, which is the number of working devices on a wafer. This mini environment is within an EFEM (equipment front end module) which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally, many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. Fabrication plants need large amounts of liquid nitrogen to maintain the atmosphere inside production machinery and FOUPs, which are constantly purged with nitrogen. There can also be an air curtain or a mesh between the FOUP and the EFEM which helps reduce the amount of humidity that enters the FOUP and improves yield.

l part being the "clean room". In more advanced semiconductor devices, such as modern 14/10/7 nm nodes, fabrication can take up to 15 weeks, with 11–13 weeks being the industry average. Production in advanced fabrication facilities is completely automated, with automated material handling systems taking care of the transport of wafers from machine to machine. A wafer often has several integrated circuits, which are called dies as they are pieces diced from a single wafer. Individual dies are separated from a finished wafer in a process called die singulation, also called wafer dicing. The dies can then undergo further assembly and packaging. Within fabrication plants, the wafers are transported inside special sealed plastic boxes called FOUPs. FOUPs in many fabs contain an internal nitrogen atmosphere which helps prevent copper from oxidizing on the wafers. Copper is used in modern semiconductors for wiring. The interior components of the processing equipment and FOUPs is kept cleaner than the surrounding air in the cleanroom. This internal atmosphere is known as a mini-environment and helps improve yield, which is the number of working devices on a wafer. This mini environment is within an EFEM (equipment front end module) which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally, many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. Fabrication plants need large amounts of liquid nitrogen to maintain the atmosphere inside production machinery and FOUPs, which are constantly purged with nitrogen. There can also be an air curtain or a mesh between the FOUP and the EFEM which helps reduce the amount of humidity that enters the FOUP and improves yield.

In 1955, Carl Frosch and Lincoln Derick, working at Bell Telephone Laboratories, accidentally grew a layer of silicon dioxide over the silicon wafer, for which they observed surface passivation effects. By 1957 Frosch and Derick, using masking and predeposition, were able to manufacture silicon dioxide transistors; the first planar field effect transistors, in which drain and source were adjacent at the same surface. At Bell Labs, the importance of their discoveries was immediately realized. Memos describing the results of their work circulated at Bell Labs before being formally published in 1957. At Shockley Semiconductor, Shockley had circulated the preprint of their article in December 1956 to all his senior staff, including Jean Hoerni, who would later invent the planar process in 1959 while at Fairchild Semiconductor. In 1948, Bardeen patented an insulated-gate transistor (IGFET) with an inversion layer; Bardeen's concept forms the basis of MOSFET technology today. An improved type of MOSFET technology, CMOS, was developed by Chih-Tang Sah and Frank Wanlass at Fairchild Semiconductor in 1963. CMOS was commercialised by RCA in the late 1960s. RCA commercially used CMOS for its 4000-series integrated circuits in 1968, starting with a 20 μm process before gradually scaling to a 10 μm process over the next several years. Many early semiconductor device manufacturers developed and built their own equipment such as ion implanters. In 1963, Harold M. Manasevit was the first to document epitaxial growth of silicon on sapphire while working at the Autonetics division of North American Aviation (now Boeing). In 1964, he published his findings with colleague William Simpson in the Journal of Applied Physics. In 1965, C.W. Mueller and P.H. Robinson fabricated a MOSFET (metal–oxide–semiconductor field-effect transistor) using the silicon-on-sapphire process at RCA Laboratories. Semiconductor device manufacturing has since spread from Texas and California in the 1960s to the rest of the world, including Asia, Europe, and the Middle East. Wafer size has grown over time, from 25 mm (1 inch) in 1960, to 50 mm (2 inches) in 1969, 100 mm (4 inches) in 1976, 125 mm (5 inches) in 1981, 150 mm (6 inches) in 1983 and 200 mm in 1992. In the era of 2-inch wafers, these were handled manually using tweezers and held manually for the time required for a given process. Tweezers were replaced by vacuum wands as they generate fewer particles which can contaminate the wafers. Wafer carriers or cassettes, which can hold several wafers at once, were developed to carry several wafers between process steps. However, since wafers still had to be individually removed, processed, and returned, acid-resistant carriers were later introduced so the entire cassette could be dipped directly into wet etching and cleaning tanks, eliminating this time-consuming process. When wafer sizes increased to 100 mm, the entire cassette would often not be dipped as uniformly, and the quality of the results across the wafer became hard to control. By the time 150 mm wafers arrived, the cassettes were not dipped and were only used as wafer carriers and holders to store wafers, and robotics became prevalent for handling wafers. With 200 mm wafers, manual handling of wafer cassettes becomes risky as they are heavier. In the 1970s and 1980s, several companies migrated their semiconductor manufacturing technology from bipolar to MOSFET technology. Semiconductor manufacturing equipment has been considered costly since 1978. In 1984, KLA developed the first automatic reticle and photomask inspection tool. In 1985, KLA developed an automatic inspection tool for silicon wafers, which replaced manual microscope inspection. In 1985, SGS (now STmicroelectronics) invented BCD, also called BCDMOS, a semiconductor manufacturing process using bipolar, CMOS and DMOS devices. Applied Materials developed the first practical multi-chamber, or cluster wafer processing tool, the Precision 5000. Until the 1980s, physical vapor deposition was the primary technique used for depositing materials onto wafers, until the advent of chemical vapor deposition. Equipment with diffusion pumps was replaced with those using turbomolecular pumps, as the latter do not use oil, which often contaminates wafers during processing in vacuum. 200 mm diameter wafers were first used in 1990 and became the standard until the introduction of 300 mm diameter wafers in 2000. Bridge tools were used in the transition from 150 mm wafers to 200 mm wafers and in the transition from 200 mm to 300 mm wafers. The semiconductor industry has adopted larger wafers to cope with the increased demand for chips as larger wafers provide more surface area per wafer. Over time, the industry shifted to 300 mm wafers which brought along the adoption of FOUPs, but many products that are not advanced are still produced in 200 mm wafers such as analog ICs, RF chips, power ICs, BCDMOS and MEMS devices. Some processes such as cleaning, ion implantation, etching, annealing and oxidation started to adopt single wafer processing instead of batch wafer processing to improve the reproducibility of results. A similar trend existed in MEMS manufacturing.

tatic electricity. Corona discharge sources can also be used to reduce static electricity. Often, a fab will be constructed in the following manner (from top to bottom): the roof, which may contain air handling equipment that draws, purifies and cools outside air, an air plenum for distributing the air to several floor-mounted fan filter units, which are also part of the cleanroom's ceiling, the cleanroom itself, which may or may not have more than one story, a return air plenum, the clean subfab that may contain support equipment for the machines in the cleanroom such as chemical delivery, purification, recycling and destruction systems, and the ground floor, that may contain electrical equipment.

lenum for distributing the air to several floor-mounted fan filter units, which are also part of the cleanroom's ceiling, the cleanroom itself, which may or may not have more than one story, a return air plenum, the clean subfab that may contain support equipment for the machines in the cleanroom such as chemical delivery, purification, recycling and destruction systems, and the ground floor, that may contain electrical equipment.

llion (e.g. EUV scanners). A typical fab will have several hundred equipment items. Semiconductor fabrication requires many expensive devices. Estimates put the cost of building a new fab at over one billion U.S. dollars with values as high as tens of billions of dollars not being uncommon. For example, TSMC invested over $45 billion into a new fab for their 2nm process. A foundry model emerged in the 1990s: Companies owning fabs that produced their own designs were known as integrated device manufacturers (IDMs). Companies that outsourced manufacturing of their designs were termed fabless semiconductor companies. Those foundries which did not create their own designs were called pure-play semiconductor foundries. In the cleanroom, the environment is controlled to eliminate all dust, since even a single speck can ruin a microcircuit, which has nanoscale features much smaller than dust particles. The clean room must also be damped against vibration to enable nanometer-scale alignment of photolithography machines and must be kept within narrow bands of temperature and humidity. Vibration control may be achieved by using deep piles in the cleanroom's foundation that anchor the cleanroom to the bedrock, careful selection of the construction site, and/or using vibration dampers. Controlling temperature and humidity is critical for minimizing static electricity. Corona discharge sources can also be used to reduce static electricity. Often, a fab will be constructed in the following manner (from top to bottom): the roof, which may contain air handling equipment that draws, purifies and cools outside air, an air plenum for distributing the air to several floor-mounted fan filter units, which are also part of the cleanroom's ceiling, the cleanroom itself, which may or may not have more than one story, a return air plenum, the clean subfab that may contain support equipment for the machines in the cleanroom such as chemical delivery, purification, recycling and destruction systems, and the ground floor, that may contain electrical equipment.

Boise (locally also ) is the capital and most populous city in the U.S. state of Idaho. It is the county seat of Ada County. The population of the city was 235,685 at the 2020 census. The Boise metropolitan area, located in the Treasure Valley, includes five counties of Idaho with an estimated population of 846,000, the most populous metropolitan area in Idaho and 95th-most populous in the United States. Located on the Boise River in southwestern Idaho, it is 41 miles (66 km) east of the Oregon border and 110 miles (177 km) north of the Nevada border. Downtown Boise's elevation is 2,704 feet (824 m) above sea level. Boise is home to major employers in the technology, manufacturing, and service sectors, including companies such as Micron Technology and Hewlett-Packard.

the Treasure Valley, includes five counties of Idaho with an estimated population of 846,000, the most populous metropolitan area in Idaho and 95th-most populous in the United States. Located on the Boise River in southwestern Idaho, it is 41 miles (66 km) east of the Oregon border and 110 miles (177 km) north of the Nevada border. Downtown Boise's elevation is 2,704 feet (824 m) above sea level. Boise is home to major employers in the technology, manufacturing, and service sectors, including companies such as Micron Technology and Hewlett-Packard.

ise River in southwestern Idaho, it is 41 miles (66 km) east of the Oregon border and 110 miles (177 km) north of the Nevada border. Downtown Boise's elevation is 2,704 feet (824 m) above sea level. Boise is home to major employers in the technology, manufacturing, and service sectors, including companies such as Micron Technology and Hewlett-Packard.

jurisdiction over all the local county and city streets, except for private roads and state roads. In the interior Pacific Northwest east of the Cascade Range, Ada County ranks second in population, behind Spokane County, Washington. History Ada County was created by the Idaho Territory legislature on December 22, 1864, partitioned from Boise County. It is named for Ada Riggs, the daughter of H. C. Riggs, a member of the legislature; he established the county and was a co-founder of Boise.

94,967, which by 2025 was estimated to have risen to 546,141. Ada County is by far the state's most populous county; it is home to 26.8% of the state's population. The county seat and largest city is Boise, which is also the state capital. Ada County is included in the Boise metropolitan area. The Ada County Highway District has jurisdiction over all the local county and city streets, except for private roads and state roads.

History Ada County was created by the Idaho Territory legislature on December 22, 1864, partitioned from Boise County. It is named for Ada Riggs, the daughter of H. C. Riggs, a member of the legislature; he established the county and was a co-founder of Boise. Canyon County, which originally included Payette County and most of Gem County, was partitioned from western Ada County in 1891. Geography According to the United States Census Bureau, the county has a total area of 1,060 square miles (2,700 km2), of which 1,053 square miles (2,730 km2) is land and 7.9 square miles (20 km2) (0.7%) is water. The Boise River flows through the northern portion of the county, and the northwest border is bounded by the foothills of the Boise Range mountains; the summits are in adjacent Boise County.

Kuna ( KYOO-nə) is a city in Ada County, Idaho. It is part of the Boise metropolitan area. The population was 24,011 at the time of the 2020 census. Kuna is one of the fastest-growing areas in Idaho, having nearly tripled in population between 2000 and 2010 and a nearly additional 60 percent gain between 2010 and 2020.

History Kuna originated as a railroad stop with coach transport to Boise. It is popularly believed, as cited by the Kuna Chamber of Commerce, that the translation of the name "Kuna" means "the end of the trail", but Charles S. Walgamott cites the origin of the name as a Shoshone Indian word meaning "green leaf, good to smoke." The Western Heritage Historic Byway, designated as a national as well as a state scenic byway, travels around a number of historic sites in the area. Geography Kuna's business center is approximately 18 miles (29 km) southwest of downtown Boise, the state capital. According to the United States Census Bureau, the city has a total area of 18.18 square miles (47.09 km2), of which 18.08 square miles (46.83 km2) is land and 0.10 square miles (0.26 km2) is water. South of Kuna is the Kuna Caves, a lava tube. A small seasonal creek, Indian Creek, runs through the city. It is now used as an irrigation canal, filled by the New York Canal from the Boise River Diversion Dam.

Geography Kuna's business center is approximately 18 miles (29 km) southwest of downtown Boise, the state capital. According to the United States Census Bureau, the city has a total area of 18.18 square miles (47.09 km2), of which 18.08 square miles (46.83 km2) is land and 0.10 square miles (0.26 km2) is water. South of Kuna is the Kuna Caves, a lava tube. A small seasonal creek, Indian Creek, runs through the city. It is now used as an irrigation canal, filled by the New York Canal from the Boise River Diversion Dam. One of the few small floatable waterways in the region, Indian Creek is a favorite swimming spot for local residents. Demographics 2020 census As of the 2020 census, Kuna had a population of 24,011. The median age was 30.9 years. 31.8% of residents were under the age of 18 and 8.1% of residents were 65 years of age or older. For every 100 females there were 97.8 males, and for every 100 females age 18 and over there were 96.2 males age 18 and over. 97.1% of residents lived in urban areas, while 2.9% lived in rural areas. There were 7,736 households in Kuna, of which 48.2% had children under the age of 18 living in them. Of all households, 62.3% were married-couple households, 11.6% were households with a male householder and no spouse or partner present, and 17.4% were households with a female householder and no spouse or partner present. About 13.9% of all households were made up of individuals and 4.6% had someone living alone who was 65 years of age or older. There were 7,948 housing units, of which 2.7% were vacant. The homeowner vacancy rate was 0.8% and the rental vacancy rate was 5.9%. As of the 2020 census, the median income for a household in the city was $68,017. Families had a median income of $75,296 versus $91,364 for married-couple families and $33,512 for nonfamily households.